GE IS400AEBMH1AJD Heatsink Module

Brand:GE

Item No:IS400AEBMH1AJD

Unit price:999$

Condition: Brand new and original

Quality Guarantee: 1 Year

Payment : T/T and Western Union

Delivery Time: 2-3 day

Shipping Port: China


Product Detail

Product Tags

General info

Manufacture GE
Item No IS400AEBMH1AJD
Article number IS400AEBMH1AJD
Series Mark VI
Origin United States(US)
Dimension 180*180*30(mm)
Weight 0.8 kg
Customs Tariff Number 85389091
Type Heatsink Module

 

Detailed data

GE IS400AEBMH1AJD Heatsink Module

The GE IS400AEBMH1AJD is able to maintain the temperature of various power electronic devices within the system, ensuring they operate within a safe temperature range to prevent overheating and potential damage.

IS400AEBMH1AJD is used as a thermal management component. It dissipates the heat generated by power components such as power transistors, thyristors or other power control devices.

The heat sink is designed for use in industrial environments, gas turbine control systems. It helps protect sensitive components from thermal stress and ensures that they can function properly for a long time.

The heat sink module is made of highly thermally conductive materials such as aluminum or copper, which can effectively transfer heat from the components to the surrounding environment.

IS400AEBMH1AJD

Frequently asked questions about the product are as follows:

-What is the primary function of the GE IS400AEBMH1AJD heat sink module?
The primary function is to dissipate heat generated by power electronics in turbine control systems.

-How does the GE IS400AEBMH1AJD module help prevent damage to power electronics?
By effectively dissipating heat from power components such as thyristors and power transistors, the IS400AEBMH1AJD prevents these components from exceeding their thermal limits.

-Can the IS400AEBMH1AJD be used in applications other than turbine control systems?
While the IS400AEBMH1AJD is designed for GE Mark IV and Mark V turbine control systems, the thermal management principles it provides are applicable to any high-power electronic system that requires effective cooling.


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